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Shenzhen Uniwell Circuits Co.,Ltd
Scanne Flexible Circuit Board

Scanne Flexible Circuit Board

Scanne Flexible circuit board 1.company information 1)Uniwell Circuits Co., Ltd, was established in Shenzhen, China in April, 2007. Uniwell Circuits is a high-tech enterprise focus on design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit...

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1.Product describe

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Specification:
Flexible board +PI Stiffener
Reinforcing: positive and negative 0.15mm steel sheet reinforcement.
Manufacturing process: solder coating, plug - plating, covering layer, film - coated type, resistance - welding type shielding.
Surface treatment: gold (gold)1~2 micro inch.
Minimum line width/line distance: 0.06mm/0.09mm.
Uniwell is honored the excellent supplier by many large companies over the seas . all kinds of service can be offered including PCB and PCB assembly for more than 10 years which  are highly appreciated by our clients.

2.Company information
1)Uniwell Circuits Co., Ltd, was established in Shenzhen, China in April, 2007. Uniwell Circuits is a high-tech enterprise focus on design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit Board) special in quick turn, prototype, medium and large volumes. We are actively striving for improvement and innovation, giving the competitive price and cost-effective quality printed circuit board but never forget the environment protection at the same time. With more and more trust and support from our clients, we are a leading manufacturer of PCB&PCBA products.

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2)Organization

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3.The view of our factory

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4.FPC manufacturers technology capability
Layers: 20(include 12layer)
Line wideth/space (mil) in innerlayer: 3/3, 3.5/3.5
Aspect ratio: 20:1(PTH); 1:1 (blind vias)
Min. drilling hole diameter(mil): 6(mechanical); 4(laser)
Distance from drilling to conductor(mil) :6
Tolerance for impedance control(+/-): 10%

5.FPC structure—flex& rigid

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Structure

Advantage

Disadvantage

Non-lamination flex&rigid board

Glue as adhensive, cover film on full flex layer.

Material cost low, technology is simple.

Material using termperature  low, reliability and stablity not good.

Lamination flex&rigid board

PP as adhensive, cover film on partial flex layer

Using temperatrue is high, reliability is good.

Material cost is high, technology is complicated.

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