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Shenzhen Uniwell Circuits Co.,Ltd
Mobile Phone Flexible Circuit Board

Mobile Phone Flexible Circuit Board

Mobile phone Flexible circuit board 1.product describe Specification Layer: 2 Base Material: Polyimide Copper Thickness: 1oz Board Thickness: 0.25mm Solder Mask Color: Yellow cover film Silkscreen Color: White Surface treatment: Immersion Gold 100% E-Test: 100% E-Test Standard: IPC-Class2/Class...

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Mobile phone Flexible circuit board
1.Product describe

图片54_副本.jpg 

Specification
Layer: 2
Base Material: Polyimide
Copper Thickness: 1oz
Board Thickness: 0.25mm
Solder Mask Color: Yellow cover film
Silkscreen Color: White
Surface treatment: Immersion Gold
100% E-Test: 100% E-Test
Standard: IPC-Class2/Class 3
Application: Mobile phone

Uniwell Circuits Co., Ltd, was founded in Shenzhen, China in April, 2007. . is a newly company which founded in 2007. At beginning we were only focus on manufacturing Printed Circuit Boards. But now we has become a rapidly growing worldwide provider of solutions in three principal areas Printed Circuit Boards, PCB Assembly and Components Procurement. We are dedicated to building solid partnerships and providing flexible solutions to enable our customer's success.
As an experienced PCB and PCBA manufacturer, we provide prototypes, small volume, medium volume, and high volume projects. We are able to guarantee a complete service with comprehensive technical backup, offering a cost advantage and scheduled delivery.

2.Our service
PCB design
Reverse Engineering-PCB copy, PCB clone, IC decode
Quick prototyping
Components sourcing and purchasing
FPC making Mold making and plastic injection
PCB, PCBA SMD, SMT assembly
Supply chain service

3.Quality control
Our manufacturing and quality control processes are ISO 9001: 2000 certified and conform to IPC-A600(PCB) and IPC-A610 (PCB Assembly) standards. All our PCB/PCBA are UL certified and RoHS compliant.  

图片55_副本.jpg

4.Rigid PCB production capability

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

5.FPC production capability
Layers: 20(include 12layer)
Line wideth/space (mil) in innerlayer: 3/3, 3.5/3.5
Aspect ratio: 20:1(PTH); 1:1 (blind vias)
Min. drilling hole diameter(mil): 6(mechanical); 4(laser)  
Distance from drilling to conductor(mil):6
Tolerance for impedance control(+/-): 10%

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