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Multilayer Rogers Circuit Board

Multilayer Rogers Circuit Board

Multilayer Rogers circuit board 1.product describe Specification Multilayer Rogers circuit board Layer count: 6 Material: R4350B , 1 OZ for all layer Minimum tack: 8mil Minimum space(gap): 8mil Minimum hole: 0.30mm Surface finished: immersion gold Characteristics: Rogers multilayer PCB with...

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Multilayer Rogers circuit board
1.Product describe

93_副本1.jpg

 
Specification
Multilayer Rogers circuit board
Layer count: 6
Material: R4350B  , 1 OZ for all layer
Minimum tack: 8mil
Minimum space(gap): 8mil
Minimum hole: 0.30mm
Surface finished: immersion gold
Characteristics: Rogers multilayer PCB with impedance control manufactured in an ISO9001certified facility with "ahead of the curve" process technology.


2.Our production capacity

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP


3.Technology road map
P: Prototype         SV: Small Volume            M: Mass production

ITEM

2015

2016

2017

2018

2019

Layers

32layer

P

P

SV

SV

SV

36layer

 

P

P 

P

P

42layer

 

 

P 

P

P

Min. Line width/space

Inner Layer

3/3mil

M  

 

 

 

 

2.5/2.5mil

P

SV

SV

M

 

2/2mil

 

 

P 

P

P

Outer Layer

3/3mil

SV

SV

M

 

 

2.5/2.5mil

 

P

SV

M

 

2/2mil

 

 

P 

P

P

Min. mechanical drilling hole size

8mil

M  

 

 

 

 

6mil

P

P

SV

SV

SV

Aspect Ratio

13:1

SV 

SV

M

 

 

15:1

 

P 

SV

SV

SV

16:1

 

 

P 

SV

SV

18:1

 

 

 

P

P

Copper thickness

6 OZ

P

SV

M

 

 

8 OZ

P

P

SV

M

 

10 OZ

 

P

SV

M

 

12OZ

 

 

P 

SV

SV

finished asymmetric copper foil 1/6OZ

P

SV

M

 

 


ITEM

2015

2016

2017

2018

2019

Impedance control

±10%

M

 

 

 

 

±8%

P

P

SV

SV

SV

±5%

 

P

P 

SV

SV

Finished board thickness

 Thick

6.5mm

P

SV

M

 

 

7.5mm

P

P

SV

SV

SV

10mm

P

P

P 

P

P

 Thin

0.15mm

SV

SV

SV

SV

SV

0.1mm

 

P

P 

SV

SV

Max. finished board size

Length

1200mm

P

P

SV

SV

SV

Width

650mm

P

P

P 

SV

SV

Min. Inner layer clearance

4layers

0.075mm

 

p

P 

p

p

 8layers

0.1mm

 

p

P 

p

p

12layers

0.125mm

 

p

P 

p

p


ITEM

2015

2016

2017

2018

2019

Special Technics

 Buried capacitor/resistor

 

P

P 

SV

SV

Rigid-flexible board

 

P

SV

SV

SV

Counterbore +Blind buried VIA S(HDI)

P

P

SV

SV

SV

2-layer and multilayer Aluminum based PCB

P

SV

SV

M

 

Metal core and PTFE material combined PCB

P

P

SV

SV

SV

 Hybrid pressing (Ceramic core+FR4+Cu core)

 

P

SV

SV

SV

Multi-layer PTFE

 

 

P 

P

P

Partial Hybrid pressing(FR4+Ceramic)

P

P

SV

SV

SV

Partial Bulgy Solder PAD Technics

P

P

SV

SV

SV

Selective Surface Finish

P

SV

SV

SV

SV

Half Hole/Half Slot Technics

M  

 

 

 

 

Intersect mechanical Blind Via (hole diameter no less than 0.15mm)

 

p

P 

p

p

Back Drilling Technics

P

SV

SV

SV

SV

Via in PAD

M

 

 

 

 

V-CUT go through PTH

P

SV

M

 

 

Abnormal Slot/Hole Technics( Countersink, Half Hole, Screw hole, Control Depth Hole, Counterbore, Board Edge Plating)

SV

M

 

 

 

Multiple-Pressing(No larger than 4 times)

SV

SV

SV

SV

SV


4.Packaging & delivery
Packaging

Vacuum package or totally as your request

图片15_副本.jpg

 
Delivery

图片16_副本.jpg


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