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Red Solder Mask Aluminum Base LED PCB

Red Solder Mask Aluminum Base LED PCB

Red solder mask aluminum base led PCB 1.Video introduction Welcome have a vist to our factory , we are expecting to establish a long-term cooperative relationship with you. UNIWELL circuits cO., lTD. is a excellent supplier which is specialized in producing various customized PCBs...

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Red solder mask aluminum base led PCB


1.Product describe 

42_副本.jpg


Description


Details for Red solder mask aluminum base led PCB

Part name:

Red solder mask aluminum base led PCB

Base material:

Aluminum base laminate

Layer count:

1 layer

Copper thickness:

1oz or 35um

Finished board thickness:

1.6mm

Solder mask color:

Red/green/White/yellow/black/blue, etc.

Legend color:

Black/ White / Yellow

Surface finished:

Immersion gold

Profile:

CNC+V-CUT

Thermal conductivity:

2.0W/m-K

Insulated layer's break down voltage

≥6KV

Application area:

refrigerator LED light


Technical capacity

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

32

Max. copper (inner/outer)

5OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP


2.Video introduction

Welcome have a vist to our factory , we are expecting to establish a long-term cooperative relationship with you.
Uniwell circuits cO., lTD. is a excellent supplier which is specialized in producing various customized PCBs product,especially Alum base PCB since found in 2007. You can know more about Uniwell from attached video.

       

3.Company organization 

图片225_副本.jpg

 
4.Company strategies
Win-win partnership

● Follow and support customers strategy to acquire market

Value-added service

● Inset value-added service base on customer requirement

Cost optimization

● Continuous effect and efficient management to push manufacturing cost down

On-time delivery

● Improve delivery control procedure to ensure delivery on-time

Quality commitment

● Quality assurance and self-review system to ensure quality promotion

Ship to stock

● Effective logistic control and quality product to ensure just-in-time stock


5.Lead time & logistics
Delivery on time is our biggest feature. We provide qick turn service, 1-2 layer in 24 hours, 4-6 layer in 48 hours.

Layers

Quick-turn

Sample order

Mass order

single

24 hours

3working days

7working days

double

24 hours

4working days

7working days

4-6layer

48hours

5-6working days

10working days

8-12layer

120hours

7-9working days

15working days

FR-4 based, Exclude material lead time


6.Little knowledge--- What are the methods for improving the function of grounding and cooling?
In order to improve the grounding and heat dissipation performance of PCB, the main process is to connect the PCB directly to the copper substrate. There are three schemes for copper substrate process, namely pre-bonding, Sweat - soldering and post-bonding.

(1)Pre - bonding Pre - bonding means that the bottom copper foil of the rf plate is directly replaced by the copper substrate.In fact, the copper substrate is the underlying copper foil of the PCB, which is filled with the high frequency medium between the top copper foil.
This kind of process relies on the plate to provide the manufacturer to provide directly, actually is the ideal copper substrate technology, but the cost is higher.Because the copper substrate has a certain thickness, it is difficult to drill.At present, this kind of technology is not widely used.

(2) time! - soldering time! - soldering that maintain a PCB board original medium and copper foil is constant, based on the copper foil and a layer of copper base plate welding, copper base plate connected by solder, between copper foil and through hole leakage tin will be redundant tin welding to eliminate, prevent to produce bubbles.
This process is also good for conducting thermal conductivity, but because of the leakage of tin, the problem can sometimes affect the performance of the bubble, which has certain influence on the pass rate of the secondary furnace welding device.At present, the process cost is relatively acceptable and widely used.

(3)Post - bonding Post - bonding is actually the bonding of the bottom copper foil of the PCB with the copper substrate through a viscous medium.
If conductive adhesion is applied, the cost is relatively high.But with ordinary non - conductive adhesion, the performance is relatively poor.This process is relatively easy to process and is now widely used.


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