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Multilayer Aluminum Base Printed Circuit Board

Multilayer Aluminum Base Printed Circuit Board

Multilayer aluminum base printed circuit board 1.product describe Benefit of aluminum base printed circuit board ● Heat dissipation is dramatically superior to standard FR-4 constructions. ● The dielectrics used are typically 5 to 10 times as thermally conductive as conventional epoxy-glass and...

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Multilayer aluminum base printed circuit board

1.Product describe

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Multilayer aluminum base printed circuit board

Layer: 4Layer

Material: FR4

Mini Hole: 0.2mm

Thickness: 1.6mm

Mini Width/space: 4mil/4mil

Copper thickness: 1oz

Testing points:3500

Finish: immersion gold

Solder Mask: LPI White

Function: LED pcb



Benefit of aluminum base printed circuit board

● Heat dissipation is dramatically superior to standard FR-4 constructions.

● The dielectrics used are typically 5 to 10 times as thermally conductive as conventional epoxy-glass and a tenth of the thickness

● Thermal transfer exponentially more efficient than a conventional rigid PCB.

● Lower copper weights than suggested by the IPC heat-rise charts can be used

 Uniwell has been producing Aluminum Printed Circuit Boards (also called Metal base PCBs) for over a decade, and all of them are approved by ISO9001, ISO14001, TS16949 and UL.


2.Product detail

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP


3.Applications of aluminum PCBs

Although Power Converters and LEDs are the largest users of these products, Automotive and RF companies are also looking to take advantage of the benefits of these constructions. While a single layer construction is the simplest, other configuration options are available at Amitron, including: 


Flexible aluminum PCBs 

One of the newest developments in IMS materials is flexible dielectrics. These materials feature a polyimide resin system with ceramic fillers which provides excellent electrical insulation, flexibility and of course thermal conductivity. When applied to a flexible aluminum material like 5754 or similar, the product can be formed to achieve a variety of shapes and angles which can eliminate costly fixtures, cables and connectors. Although these materials are flexible, they are intended to be bent into place and remain in place. They are not suited for applications that are intended to be flexed regularly.


Hybrid aluminum PCBs

In a ‘Hybrid’ IMS construction a “Sub-assembly” of a non-thermal material is processed independently and then bonded to the aluminum base with thermal materials. The most common construction is a 2-Layer or 4-Layer Sub-assembly made from conventional FR-4. Bonding this layer to an aluminum base with thermal dielectrics can help dissipate heat, improve rigidity and act as a shield. Other benefits include:

● Less costly than a construction of all thermally conductive materials

● Provides superior thermal performance over a standard FR-4 product

● Can eliminate costly heat sinks and associated assembly steps

● Can be used in RF applications where a surface layer of PTFE is desired for its’ loss characteristics.

● Use of component windows in the aluminum to accommodate through-hole components. This allows connectors and cables to pass connections through the substrate while the solder fillet creates a seal without the need for special gaskets or other costly adapters.


Multilayer aluminum PCBs

Common in the high performance power supply market, multilayer IMS PCBs are made from multiple layers of thermally conductive dielectrics. These constructions have one or more layers of circuitry buried in the dielectric with blind vias acting as either thermal vias or signal vias. While more expensive and less efficient at transferring heat as a single layer designs, they provide a simple and effective solution for heat dissipation in more complex designs.


Through-Hole aluminum PCBs

In the most complex constructions a layer of aluminum can form a ‘Core’ of a multilayer thermal construction. The aluminum is pre-drilled and back-filled with dielectric prior to lamination. Thermal materials or sub-assemblies can be laminated to both sides of the aluminum using thermal bonding materials. Once laminated, the completed assembly is thru-drilled similar to a conventional multilayer PCB. The plated through holes pass through the clearances in the aluminum to maintain electrical insulation. Alternatively a Copper core can allow both direct electrical connections as well as with insulated through holes.


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