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Green Solder Mask Aluminum Base LED Circuit Board

Green Solder Mask Aluminum Base LED Circuit Board

Green solder mask aluminum base led circuit board 1.about UNIWELL UNIWELL circuits co., lTD. has a professional technical team with 10 years’ of experience in PCB manufacturing. You can know more about UNIWELL from video attached. 2.Product describe specification Product ion parameter : 3.glance...

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Green solder mask aluminum base led circuit board


1.Product describe 

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Specification

Details for Green solder mask aluminum base led circuit board

Part name:

Green solder mask aluminum base led circuit board

Base material:

Aluminum base laminate

Layer count:

1 layer

Copper thickness:

1oz or 35um

Finished board thickness:

1.6mm

Solder mask color:

green/White/yellow/black/blue, etc.

Legend color:

Black/ White / Yellow

Surface finished:

Immersion gold

Profile:

CNC+V-CUT

Thermal conductivity:

2.0W/m-K

Insulated layer's break down voltage

≥6KV

Application area:

refrigerator LED light

Production parameter:

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP


2.About Uniwell

Uniwell circuits co., lTD. has a professional technical team with 10+ years’ of experience in PCB manufacturing. You can know more about UNIWELL from video attached.



3.Glance of Uniwell circuits production

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4.Our certificates 


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5.Little knowledge--- What are the restrictive rules of the manufacturing process?
Rules of circuit board production (Manufacturing) is the plate-making process rules, including Minimum Annular Ring (Minimum Annular limit rules), Acute Angle (Acute Angle limit rules), the Hole Size (aperture Size design rules) and the Layer Pairs (plate Layer to design rule) four rules.

(1)Minimum annular ring
This rule is used to set the bonding pad and via the minimum width of the annular copper membrane, in the column of constraint minimum annular (x, y)], and set the bonding pad or the diameter of the hole and its hole diameter difference, the default setting is 10 mil, you can be set according to the requirements of the system board business process.

(2)Acute angle
This rule is used to set the minimum value of the copper film line Angle, and the default setting is 90 degrees, which should not be less than 90 degrees in normal circumstances.

(3)Hole size
The rules are used to set the hole diameter on the floor, in the "constraint" bar, the measurement method can select the Absolute (Absolute value), you can enter below minimum and maximum aperture, by default, the minimum value of 1 mil, a maximum of 100 mil.You can also select the Percent item (in percentage form), the default minimum is 20%, and the maximum value is 80%.

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