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Shenzhen Uniwell Circuits Co.,Ltd

OSP Multilayer PCB

OSP multilayer PCB 1.Product Description Uniwell was founded in April 2007,we have 2 factories, one in Shenzhen, and the other in Jiangmen . we produce various printed circuit board, 4layer pcb ,6layer pcb, 8layer circuit board, 10layer circuit board, 12layer pcb,14layer pcb,16layer pcb up to...

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OSP multilayer PCB

1.Product description

图片17_副本.jpg 

Specification: 

Layer: 4
Board Thickness: 1.0 mm
Surface treatment: immersion gold.
Material: FR4 TG135.
Min line width/line distance:6/6mil
Special requirement: impedance control

Uniwell was founded in April 2007,we have 2 factories, one in Shenzhen, and the other in Jiangmen . We produce various printed circuit board,  4layer pcb ,6layer pcb, 8layer circuit board, 10layer circuit board, 12layer pcb,14layer pcb,16layer pcb up to 32layer , HDI printed circuit board ,high frequency printed circuit board ect…. These printed circuit boards with HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver. It is important for us to know your needs in definite terms, For a free consultation email us 

2.Capability of PCB manufacturing 

1) Shenzhen factory: Shenzhen factory special for Prototype. Sampling and Small volume orders

Material


Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

2) Jiangmen factory: Jiangmen factory special for medium volume and mass production order.

Material

FR4(normal or high TG  or Halogen free)

CEM-3  Al based

Max. Finishing Board Size

540X620 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.2mm

Aspect ration

12:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm  &  +/-0.05mm & +/-0.05mm

Max. Layer Count

12

Max. copper thickness

3 OZ inner layer/4OZ  outer layer

Target drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

4/4mil

BGA pitch

10mil

Surface treatment

HASL, Lead free HASL,

ENIG(+ G/F), Immersion silver/Tin OSP, Peelable mask, Carbon paste

3.Our service

●,Offer quality product with competitive price.

●,Comprehensive service for order following and tracking.

●,Shipping cost inquiry to your destination port.

●,OEM and customize design for your potential marketing product.

●,Friendly service and prompt reply within 24 hours.

●,For any quality problem, we have complete after-sales team to track and service the relevant process.

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