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Shenzhen Uniwell Circuits Co.,Ltd
Multilayer Carbon Ink Circuit Board

Multilayer Carbon Ink Circuit Board

Multilayer Carbon ink circuit board 1.product describe 10 years professional pcb manufacturer With years of export experience along with excellent quality, advanced services and competitive prices, Uniwell has won numerous customers' trust and support. 2.our advanced machine Drilling is the...

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Multilayer Carbon ink circuit board

1.Product describe

7_副本.jpg


Multilayer Carbon ink circuit board

Main technical parameter:


Rang of total resistance:

1 KΩ-1 MΩ

Resistance tolerance:

±20%

Resistance to heat:

260℃ ±5℃, 5sec. △TR≤±50%

Durability:

1 Million cycles Min


10 years professional pcb manufacturer With years of export experience along with excellent quality, advanced services and competitive prices, Uniwell has won numerous customers' trust and support.


2.our advanced machine



图片84.jpg


Drilling is the important process in the PCB production, we have our own drilling line.

图片85.jpg

 
First we will exposure the Gerber circuit onto the film and then we will manufacture the PCB exactly the same according to the film. In the meanwhile, we maintain our workshop clean all day long to ensure the accuracy of exposure.

图片86.jpg

 
For multi-layer sheet, we use AOI equipment for inner inspection to ensure the inner quality.

Other machine

图片87.jpg图片88.jpg图片89.jpg


3.TECHNOLOGY ROAD MAP

Since established, Uniwell Circuits has set up a powerful R & D team to improve its technology capability.
P: Prototype         SV: Small Volume            M: Mass production

ITEM

2015

2016

2017

2018

2019

Layers

32layer

P

P

SV

SV

SV

36layer

 

P

P

P

P

42layer

 

 

P

P

P

Min. Line width/space

Inner Layer

3/3mil

M

 

 

 

 

2.5/2.5mil

P

SV

SV

M

 

2/2mil

 

 

P

P

P

Outer Layer

3/3mil

SV

SV

M

 

 

2.5/2.5mil

 

P

SV

M

 

2/2mil

 

 

P

P

P

     Min. mechanical drilling hole size

8mil

M

 

 

 

 

6mil

P

P

SV

SV

SV

Aspect Ratio

13:1

SV

SV

M

 

 

15:1

 

P

SV

SV

SV

16:1

 

 

P

SV

SV

18:1

 

 

 

P

P

Copper thickness

6 OZ

P

SV

M

 

 

8 OZ

P

P

SV

M

 

10 OZ

 

P

SV

M

 

12OZ

 

 

P

SV

SV

finished asymmetric copper foil 1/6OZ

P

SV

M

 

 


ITEM

2015

2016

2017

2018

2019

Impedance control

±10%

M

 

 

 

 

±8%

P

P

SV

SV

SV

±5%

 

P

P

SV

SV

Finished board thickness

 Thick

6.5mm

P

SV

M

 

 

7.5mm

P

P

SV

SV

SV

10mm

P

P

P

P

P

 Thin

0.15mm

SV

SV

SV

SV

SV

0.1mm

 

P

P

SV

SV

Max. finished board size

Length

1200mm

P

P

SV

SV

SV

Width

650mm

P

P

P

SV

SV

Min. Inner layer clearance

4layers

0.075mm

 

p

P

p

p

 8layers

0.1mm

 

p

P

p

p

12layers

0.125mm

 

p

P

p

p


ITEM

2015

2016

2017

2018

2019

Special Technics

 Buried capacitor/resistor

 

P

P

SV

SV

Rigid-flexible board

 

P

SV

SV

SV

Counterbore +Blind buried VIA S(HDI)

P

P

SV

SV

SV

2-layer and multilayer Aluminum based PCB

P

SV

SV

M

 

Metal core and PTFE material combined PCB

P

P

SV

SV

SV

 Hybrid pressing (Ceramic core+FR4+Cu core)

 

P

SV

SV

SV

Multi-layer PTFE

 

 

P 

P

P

Partial Hybrid pressing(FR4+Ceramic)

P

P

SV

SV

SV

Partial Bulgy Solder PAD Technics

P

P

SV

SV

SV

Selective Surface Finish

P

SV

SV

SV

SV

Half Hole/Half Slot Technics

M

 

 

 

 

Intersect mechanical Blind Via (hole diameter no less than 0.15mm)

 

P

P

P

P

Back Drilling Technics

P

SV

SV

SV

SV

Via in PAD

M

 

 

 

 

 V-CUT go through PTH

P

SV

M

 

 

Abnormal Slot/Hole Technics( Countersink, Half Hole, Screw hole, Control Depth Hole, Counterbore, Board Edge Plating)

SV

M

 

 

 

Multiple-Pressing(No larger than 4 times)

SV

SV

SV

SV

SV


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