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Shenzhen Uniwell Circuits Co.,Ltd
Mobile Phone Circuit Board

Mobile Phone Circuit Board

Mobile phone circuit board 1.company information 1) Quick Detail of Uniwell Uniwell circuits was established in 2007, based in Shenzhen, China, specialized in the production of printed circuit boards. As a long history China based PCB manufacturer, Uniwell circuits manufactures different types...

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Mobile phone circuit board
1.Product description 

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Specification
Layer: 2
Board Thickness: 1.2 mm
Surface treatment: LF HASL.
Material: FR4 TG135 .
Min line width/line distance:7/7.8mil
Min hole:0.35mm

2.Company information
1)Quick Detail of Uniwell
Uniwell circuits  was established in 2007, based in Shenzhen, China, specialized in the production of printed circuit boards. As a long history China based PCB manufacturer, Uniwell circuits manufactures different types of PCB, including single sided PCB, double sided PCB and multi-layer P C B, up to 32 layers. Our diverse products are widely used for LED Lighting, power supply, metering, communication, consumer electronics, automobile electronics and other industries. We offers a wide rage of services from rapid PCB prototypes to large volume PCB manufacturing. 

2)Our production line
We follow international standard to operate the production. 

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3)Certifications

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3.Advanced facilities
Uniwell investigate amount in advanced equipments of telecom industry and cooperate long term with the top material supplier in the wold.

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4.Product features
1)High thermal conductivity
2)Have excellent flame retardant
3)High mechanical strength
4)Dimensional stability
5)Very good heat sink
6)Electromagnetic shielding,etc.

5.Production capability
1)Shenzhen factory

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

2)Jiangmen factory

Material

FR4(normal or high TG  or Halogen free)

CEM-3  Al based

Max. Finishing Board Size

540X620 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.2mm

Aspect ration

12:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm  &  +/-0.05mm & +/-0.05mm

Max. Layer Count

12

Max. copper thickness

3 OZ inner layer/4OZ  outer layer

Target drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

4/4mil

BGA pitch

10mil

Surface treatment

HASL, Lead free HASL,

ENIG(+ G/F), Immersion silver/Tin OSP, Peelable mask, Carbon paste

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