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High Density Interconnect PCB

High density interconnect PCB 1.Product Description High density interconnect (HDI) is a technology that is rapidly becoming prevalent in PCB design and integration into electronic products of all kinds. HDI is a technology that provides for a much denser construction on a board by the ability...

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High density interconnect PCB

1.Product description

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Specification:
Layer:6  
Board Thickness:1.6mm
Surface treatment:Chemical gold.
Material:FR4 IT158 .
Min line width/line distance:8/8mil
Min hole:0.3mm
Special technology:HDI

High density interconnect (HDI) is a technology that is rapidly becoming prevalent in PCB design and integration into electronic products of all kinds. HDI is a technology that provides for a much denser construction on a board by the ability to place increasingly smaller components in closer proximity, which also results in shorter paths between components. 

High density interconnect PCB for car amplifier approved UL, Uniwell circuits has a experienced engineer team, We are an ISO, UL, CE approved manufacturer specialized in pcb manufacturer. 

HDI boards are preferred for applications where space, performance, reliability, and weight are concerns. This makes them more suitable for nearly every application related to electronics, consumer products, computers, and aeronautics.

2.Our certificates 

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3.Quality system 

We have fully quality system and professional QA engineers to check boards seriously before we ship to customers.

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4.Benefits of high density interconnect

High density interconnect technology is widely used in printed circuit boards now, HDI boards are preferred for applications where space, performance, reliability, and weight are concerns. This makes them more suitable for nearly every application related to electronics, consumer products, computers, and aeronautics. HDI boards utilize buried or blind vias, or a combination, and may also incorporate microvias with an incredibly small diameter. This facilitates the incorporation of more technology in less space, with fewer layers. Multi-layer HDI boards are also in common use, with many layers being accommodated through various construction methods utilizing blind, buried, stacked, and staggered vias. 

With smaller components and blind via and via in pad technology, components may be placed closer together, resulting in faster signal transmission rates while also reducing crossing delays and signal loss. These are key considerations that generate improved performance of HDI PCBs.

5.FAQ 

Q:Do I have to use an FR4 material with a high Tg (Tg = glass transition temperature) for lead-free soldering? 

No, not necessarily. There are many factors to be taken into account, e.g. how many layers, the thickness of the PCB and also a good understanding of the assembly process (number of soldering cycles, time above 260 degrees, etc.). Some research has shown that a material with a “standard” Tg value has even performed better than some materials with a higher Tg value. Note that even with “leaded” soldering the Tg value is exceeded.

What is of most importance is how the material behaves at temperatures above the Tg value (post Tg) so knowing the temperature profiles the board will be subjected to will help you look evaluate the necessary performance characteristics. 

Q:Do I have to use an FR4 material with the highest Td (Td = decomposition temperature) for lead-free soldering? 

A greater Td value is preferable, especially if the board is technically complex and exposed to a number of remelting solderings, but this can lead to higher costs. Knowing your assembly process can help make the right choices. 

Q:What's pcb stencil? 

It's a thin steel plate,there are many pad holes on it.The blank is just write empty and pcb pad location exactly shout.This thing is automatic or semi-automatic machine attached to the chip used.Steel mesh cover on the board,then brush the paste,on such a circuit board solder pads ,then put components on.Heating furnace inside the house,they weld better.

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