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GPS Car Navigation PCB

GPS Car Navigation PCB

GPS car navigation PCB 1.Product descripe Board thickness:1.2+/-0.12mm material:shengyi S1000-2M size:122mm*75mm min hole:0.2mm min line width:0.12mm min line space:0.099mm copper thickness:20um copper weight:1OZ min bridge:0.08mm finished treatment:ENIG(≥1u") application:GPS car navigation...

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1.Product describe

图片113_副本.jpg

Specification:
Layer: 10
Board Thickness: 2.0 mm
Surface treatment: immersion gold.
Material: IT180A .
Min line width/line distance:4/4mil 

Our products are mainly used in electronics products like mobile phone, Computer, Laptop, Printer, Scanner, Fax machine, Copier ,DVD, Digital camera, Notebook, Tablet PC. Car GPS navigation is also one of the product widely used FPC. Car GPS navigation FPC have below advantage: low cost, more flexible and with lighter weight. With 10+ years research and development, Uniwell already gained great success among car GPS navigation FPC suppliers.

2.Why choose us to be your automotive products supplier?
1)Strictly follow IATF16949 international quality management system standard. Offer reliable products to our clients.
2)Top technical team with rich experience in automotive products.
3)Advanced process capability to meet the PCB board requirements.
4)Strict quality control system for you to build high reliability car PCB.
Due to our reliable products and comprehensive service, we win lots of trust and support from automotive company from all around the world.

图片114_副本.jpg

3.Technical detail for car GPS navigation 

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

4.PCB printed circuit board common failure dialysis.
PCB, commonly known as printed circuit board, is an indispensable part of electronic components and plays a central role.In a series of production processes of PCB, there are a lot of matching points, and there will be defects in the board, and the quality problems of PCB will be endless.Therefore, after the circuit board is formed, the test test becomes an indispensable link.Please share with us the breakdown of PCB circuit board and its solution. 

1)The PCB board is often stratified in use.
Reason :(1) supplier material or process problem.
(2) poor distribution of design materials and copper surface.
(3) the storage time is too long, which exceeds the shelf life, and the PCB board is damp.
(4) improper packing or storage, dampness.
Countermeasures: choose the packaging, use the constant temperature and humidity equipment to store.Completes the PCB factory reliability test, such as: PCB thermal stress test of reliability tests, responsible for the supplier is more than five times stratification as the standard, in the sample stage and mass production of each cycle for confirmation, and generally the manufacturer may require only 2 times, and a few months will only be confirmed once.However, the IR test of the simulated paste can also prevent the outflow of defective products, which is a must for the excellent PCB factory.In addition, the PCB board Tg to choose above 145 ℃, such ability is safe.
Reliability testing equipment: constant temperature and humidity chamber, stress screening test chamber, PCB reliability test equipment. 

2)Poor soldering of PCB board.
Reason: the placement time is too long, causing moisture absorption, the layout is polluted, oxidized, the black nickel is abnormal, the welding SCUM (shadow) is shielded, and the PAD is shielded.
Solution: we should pay close attention to the quality control plan of PCB factory and the standard of maintenance.Black nickel, for example, needs to see PCB factories have gold outgoing, gold wire potions concentration is stable, frequency analysis, enough whether to set up a regular stripping gold test and test to detect phosphorus content, internal soldering test whether there is a good execution, etc. 

3)Board bending of PCB board.
Reason: the supplier selection is unreasonable, the heavy industry control is bad, the storage is improper, the operation pipeline is abnormal, the copper area of each layer is obvious, the fracture hole is not strong enough.
Countermeasures: after pressurizing the sheet with wood pulp, it should be packed and shipped, so as to avoid deformation in the future. If necessary, clamp the clamp on the patch to prevent the device from being too heavy.PCB needs to simulate the IR condition to test before packaging, so as to avoid the undesirable phenomenon of bending after the furnace. 

4)Poor impedance of PCB board.
Reason: the impedance difference between PCB batch is relatively large.
Response: the manufacturer should attach the batch test report and the impedance strip to the manufacturer when delivering the goods. If necessary, it should provide the comparison data of the inner diameter of the board and the side diameter of the plate. 

5)Anti-welding bubbling/peeling.
Reason: there are differences in the selection of anti-welding ink, and the welding process of PCB is abnormal, and the temperature of heavy industry or patch is too high.
Countermeasures: PCB suppliers need to develop reliability test requirements for PCB boards and control them in different production processes. 

6)The cavani effect.
Reason: in the process of OSP and large gold surface, the electron will be dissolved into copper ions and the potential difference between gold and copper will occur.
Response: manufacturers need to keep a close eye on the potential difference between gold and copper in the production process.

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