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ENIG Double Sided PCB

ENIG Double Sided PCB

ENIG double sided PCB 1.Company Information UNIWELL circuits co., LTD. is a professional Printed Circuit Board (PCB) manufacturer from China, we are specialized in providing fabrication service for rigid PCB, flex PCB, rigid-flex PCB ,high frequency PCB and also aluminum base PCB. We have 2...

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ENIG double sided PCB
1.Product description

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Specification:
Layer:2  
Board Thickness:1.6mm
Surface treatment:Chemical gold.
Material:FR4 TG130 .
Min line width/line distance:10/10mil
Min hole:0.3mm

2.Company information  

UNIWELL circuits co., lTD. is a professional Printed Circuit Board (PCB) manufacturer from China, we are specialized in providing fabrication service for rigid PCB, flex PCB, rigid-flex PCB ,high frequency PCB and also aluminum base PCB. We have 2 factories, we can fully meet your prototype to volume orders command. We focus very much on product quality and we have got IS09001-2008, ISO TS16949:2009 certificate for automotive industry in Oct. 2010.The application fields of our products are various like: consumer electronics, industry, automotive, communication, IT, security, medical products and more. We are expecting to be your long term partner in China.

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3.Key specifications

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

Free charge E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, Class 2/3
Outgoing reports: final inspection, E-test, solderability test, microsection and more
Certificates: UL, RoHS, ISO14001:2004, ISO/TS16949:2009

4.What is a capped via hole? 

A capped via is when plating is added over the via hole so that the surface is fully metalised with a minimum copper / cap plating thickness of 5um for class 2 demands, or 12um for class 3 demands. 

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This is reliant upon the via filling material being epoxy resin as opposed to soldermask, as the epoxy will minimise the risk of air bubbles or expansion of the fill during soldering operations.This can be categorised within IPC-4761 as type VII – filled and capped via holes. It is typically used for designs with via in pad or in BGA applications where high density features are required.

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