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Double Sided Immersion Gold PCB

Double Sided Immersion Gold PCB

1.product describe Board thickness: 0.2-8.0mm Max. Finishing Board Size: 1500X610 mm Min width/ space: 6mil/6mil Copper weight: 18µm,-350µm, Min hole 0.25mm (10mil) Surface treatment: ENIG (2U”) Uniwell Circuits offers ISO9001, ISO14001, TS16949 , UL certified products ,So they are widely...

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1.Product describe 


Layer: 2  
Board Thickness: 2.45 mm
Surface treatment:immersion gold.
Material: FR4.
Min line width/line distance:15/20mil
Min hole:0.3mm
Special requirement:counter sink, blind via

Uniwell Circuits offers ISO9001, ISO14001, TS16949 , UL certified products ,So they are widely applied in communication, network, digital products, industrial control, medical care, aeronautics & astronautics, defense & military fields, as well.


2.With 10+ years’development ,we build up a professional R&D team, that make our has the latest technology.


FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)


Aspect ration


Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count


Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance


Layer to layer registration


Min. line width/space


BGA pitch


Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

3.Company information
Uniwell circuits co., lTD was found in 2007, in China, it is a enterprise integrating printed circuit board, PVC film panel/switch design and processing. After a decade of development, UNIWELL circuits has developed into a high-tech enterprise integrating printing plate design, processing, sales and new materials, new technology and new technology. UNIWELL circuits has already approved by ISO9000 international quality system certification environmental management system certification. Product performance has reached the us IPC and related national standards. 

Uniwell has advanced, complete production equipment, all the process is completed in the factory. And it has a number of proprietary technologies. The high accuracy, high density circuit board and thin film panel manufactured by the company are widely used in precision instruments such as computer, post and telecommunication, industrial instruments, instruments and household appliances. The company's customers are all over the country, the main customers are: samsung electronics, hisense electronics, sangle solar energy, haier appliances, jiuyang household appliances, gree air conditioners, rennori, etc. Through our customer's sales network, our products have been sold in the United States, Singapore, Korea and other places.


4.Annual sales turnover


5.PCB processing special process terminology manual.
1)Additive process addition method.

The direct growth process of a local conductor line in a chemical copper layer with the assistance of a non-conductive substrate, with the assistance of an additional resistance agent (see board information magazine no. 47, P.62).The addition method of the circuit board can be divided into different ways, such as total addition, semi-addition and partial addition. 

2)Backpanel, backplane support plate.
A circuit board with thicker thickness (such as 0.093",0.125"), which is specially used to connect other boards.The method is to insert a multi-pin Connector (Connector) in the tight hole, but not solder, and then wire the Connector through the guide wire of the board, and then wire the wires one by one.The general circuit board can be inserted separately on the connector.Due to the special board, the hole can not solder, but let the hole wall and needle clamping use directly, so the quality and the aperture is particularly strict, the orders are not many, the general circuit board factory don't want to also not easy to pick up this order, in the United States is almost a high grade of the special industry. 

3)Build up process increasing process.
This is a new field of thin laminated practice, is the earliest enlightenment derived from IBM SLC process, in its Japanese Yasu plant trial production began in 1989, the law is based on the traditional double panel, since the two outer panel first comprehensive quality such as Probmer52 before coating liquid photosensitive, after half a hardening and sensitive solution like make the mines with the next layer of shallow form "sense of optical hole" (Photo - Via), and then to chemical comprehensive increase conductor of copper and copper plating layer, and after line imaging and etching, can get the new wire and with the underlying interconnection buried hole or blind hole.Such repeated layers will provide multiple layers of required layers.This method not only eliminates the cost of expensive mechanical drilling, but also reduces its aperture to below 10mil.Over the past 5 ~ 6 years, all kinds of breaking the traditional layer adopt a successive multilayer technology, in the European industry under the push, make such BuildUpProcess, existing products are listed more than more than 10 kinds.In addition to the above "light-sensitive hole";After removal of the copper skin, different "hole" approaches are made for the alkaline chemical bite holes, LaserAblation and PlasmaEtching of organic plates.And it is also possible to use a new type of semi-hardened resin coated with the new "ResinCoatedCopperFoil", which is made from SequentialLamination to a smaller, smaller and thinner multilayer board.In the future, diversified personal electronic products will become the world of this kind of truly thin and thin multi-layer board. 

4)Cermet pottery.
Mixed with metal powder, ceramic powder add uf agent as a kind of coating, can be in circuit board face (or inner) with a thick film or film printing way, as the "resistor" cloth with resettlement, instead of the assembly when coupled with a resistor. 

It is a process of Hybrid circuit board (Hybrid), which has been printed on a small board with ThickFilmPaste lines, which are fired at high temperature.The various organic carriers in the thick film paste were burned, leaving the lines of the precious metal conductors as interconnection conductors. 

6)Crossover, overlapping.
The plane is crosswise between two wires, and the intersections are filled with dielectric.General single panel green paint surface plus carbon film jumper, or add layer above the following wiring is under the "more".

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