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Air Conditioner PCB

Air Conditioner PCB

Air conditioner circuit board 1.product describe specification material:shengyi S1000-2M layer:10 min line width / space:0.075mm/0.075mm min hole:0.2mm min copper thickness:25um copper weight:35um/35um/35um/35um/35um/35um/35um/35um surface treatment:ENIG (>=2um) special technology: impedance...

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Air conditioner circuit board
1.Product describe


Layer: 2  
Board Thickness: 1.55 mm
Surface treatment: LF HASL.
Material: FR4.
Min line width/line distance:10/10mil
Uniwell Circuits Co., Ltd, is a leading PCB manufacture in China, we offer a variety of PCBs, all our products are certified by ISO9001, ISO14001, TS16949 and UL.

2.Technology of air conditioner circuit board


FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)


Aspect ration


Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count


Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance


Layer to layer registration


Min. line width/space


BGA pitch


Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

3.Packing & delivery
We strictly follow the standard to package the products. 


If PCB or PCB assembly is very urgent, we will send it through official DHL, FedEx or UPS etc..
If it is not so urgent, we can send by shipment forwarder, longer time but can save you some money.


4.The production process of thick copper circuit board and the market prospect of thick PCB.
Thick copper circuit board special requirement to the copper surface, surface copper thickness, so the copper surface and great height difference between PP base material, such as required in the line between homogeneous filling welding, the process control is bad, will cause the ink to float above, unequal pseudo copper or silver ink bad phenomenon.This article through to linemask printing area, printing screen window size, incubation time and the way of printing, improved pseudo dew copper uneven, printing ink, bubbles, such as thick copper resistance welding printing problems, improve the yield of printing thick copper resistance welding. 

In recent years, the market of consumer electronic products has developed and matured, which has brought fierce competition to PCB manufacturers. In this case, on the one hand, PCB manufacturers are looking for new profit points.On the other hand the PCB manufacturer to reduce production cost changing OEM product shape, thick copper product of this is only a small number of PCB manufacturers to its high unit price advantage to become the focus of the PCB manufacturers;Generally, the inner and outer layer of copper thickness is equal to 2OZ. The circuit board is called thick copper plate. Its main characteristics are: large load current, less heat strain and heat dissipation;It is mainly used in communication equipment, aerospace, plane transformer and power supply module.Because surface requires special thick copper to copper, copper thick copper circuit board face through thicker than normal, so the copper surface with large height difference between PP substrate, such as requirements in copper surface, and the line between uniform filling welding, is a very big challenge to prevent welding printed practices, if the process control technology is not enough, the operator is bad or print will result in printing ink to float above, pseudo copper or silver ink unequal unhealthy phenomenon, this article through different methods, the welding of thick copper printing method, let the solder resist printing skills requirements for printing operators is reduced, quality to have a better improve appearance. 

The process of traditional thick copper plate resistance welding is as follows:
Resistance welding pretreatment, solder resist printing use (80-150 ml water ink) and let stand for 2-3 h - pre bake - inspection - exposure and development - to curing resistance welding, resistance welding pre-treatment (not open abrasive brush) - > printing use (80-130 ml water ink) to let stand for 2 h, pre bake - inspection - exposure and development - - after curing 

Disadvantages of traditional processes:
The printing ink corrugated: because of the thickness of copper plate copper and the base material is too big, the copper surface and the base material position of the printing ink will be thicker, the ink too thick will cause the ink wrinkle.
Ink bubble: when the ink is too thick, the foaming in the ink is difficult to line up.
The process time is long: the static time is too long, and it is easy for the ink to absorb moisture in the static process

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