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Shenzhen Uniwell Circuits Co.,Ltd
8L ENIG Normal TG Circuit Board

8L ENIG Normal TG Circuit Board

8L immersion gold normal tg circuit board 1.company information UNIWELL circuits co., lTD. is specialized in manufacturing various customized PCB&PCBA for home appliance, communication industry, car industry and LED lights industry. Service on both OEM and ODM project. We have been in PCB...

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1.Product describe


Layer: 6
Board Thickness: 1.55 mm
Surface treatment: immersion gold.
Material: FR4  .
Min line width/line distance:30/25mil
Min hole:0.32m 

Uniwell Circuits has set up a powerful R & D team to improve its technology capability for high frequency, high TG, high CTI, impedance control, buried and blind holes, rigid-flexible combination material, aluminum base, and halogen free, etc. The products of Uniwell Circuits are widely applied in communication, network, digital products, industrial control, medical care, aeronautics & astronautics, defense & military fields, as well.

2.Company information
Uniwell circuits co., lTD. is specialized in manufacturing various customized PCB&PCBA for home appliance, communication industry, car industry and LED lights industry. Service on both OEM and ODM project. We have been in PCB industry for more than 10 years. With the professional R&D team and skillful staff, we have ability to put your design into physical product, and also put your idea into workable design and product. We can offer you one stop solution from PCB, Components purchasing, Components assembly, test to the whole fabrication. 


3.Quality system
We have fully quality system ,and we sure the products ship to you are all meet national standard.


4.Specifications of our capability
We have professional R&D team to offer our clients innovative and efficient design and service. 


FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)


Aspect ration


Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count


Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance


Layer to layer registration


Min. line width/space


BGA pitch


Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

5.The advanced equipments in our factory
● Uniwell has full sets of PCB production and testing equipments
● America,Germany, Isreal, Japan imported
● High precision CNC milling machine, Optical plotter, screen printes, laminating machine
● Exposure machine, Heavy copper plating line,Gold and nickel plating line,Etching machine
● Hot air spray tin machine,Large air compressor
● Unmixed water treatment equipment,Waste water treatment equipment



6.Prevent PCB from printing plate warping method.
In the process of PCB manufacturing, the warping method is as follows:
1.Engineering design:
A.The arrangement of the semi-solidified film between layers should be symmetrical. For example, the thickness between 1 ~ 2 and 5 ~ 6 layers should be the same as that of the semi-solidified film, otherwise it will be easy to warp after laminating.
B.Multilayer board and semi-cured films shall use the same supplier's products.
C.The surface area of the outer A and B should be as close as possible.If A face is A large copper surface, and B is only A few lines, the plate is easy to warp after etching.If the area of the two sides of the line is too different, it can be balanced by adding some independent grids on the thin side. 

2)Baking sheet before feeding:
Sheet blanking before baking plate (150 degrees Celsius, 8 + 2 hours) for the purpose is to remove the moisture inside the board, and make the resin cured within plate, further eliminating residual stress in plate, which is helpful to prevent the plate warping.At present, many double-sided, multilayer boards still adhere to the material before or after the process.But there are also some board factory, now the PCB factory baking plate time rules also inconsistent, ranging from 4 to 10 hours, suggested that the class according to the production of printed circuit board and customer demand for warp degrees to decide.After cutting into a split plate after baking or after the whole material is baked, the two methods are feasible.The inner plate should also be baked. 

3)The warp and weft direction of semi-cured films:
It is necessary to distinguish between the meridional and latitudinal direction of the substrates and the laminates.Otherwise, it is easy to cause the finished plate warping after laminating, even if it is difficult to correct the pressure plate.Many of the reasons for the warping of the multilayer plate are that the warp and weft of the laminated semi-cured films are undifferentiated and caused by the overlapping.
How to distinguish between warp and weft?The direction of the rolled semi-cured film is the direction of direction, and the width direction is the zonal direction.In the case of copper foil, long edge time, short edge is the direction, if not, can be determined to the manufacturer or supplier. 

4)Stress relief after lamination:
Sandwich plate, after fulfilling the hot-pressing cold-press cut or milling burrs, then flat on baking in the oven 150 degrees Celsius for 4 hours, so that the intraplate stress gradually release and make the resin cured, this step is omitted. 

5)The plate needs to be straightened during electroplating:
0.4 ~ 0.6 mm ultrathin multilayer panel plating and electroplating graphics should make special clamping roller, the flying of the automatic electroplating line on the clip on sheet, with a round stick the whole clip roll string on the fly, thus all the boards on straightening roll, so the board will not deformation after plating.Without this measure, the sheet will bend and be difficult to remedy after plating the copper layer of 20 or 30 microns. 

6)Cooling of board after hot air leveling:
The hot air of the printing plate is affected by the high temperature of the soldering tin trough (about 250 degrees Celsius), and should be placed on the flat marble or steel plate to cool naturally, and then be cleaned by the post-processing machine.This is good for the warping of the board.Some factory to enhance the brightness of the surface of lead, tin, the board into the cold water, immediately after hot air leveling out after a few seconds in the reprocessing, such a fever a cold shock, for certain types of boards is likely to produce warping, layered or blister.In addition, the equipment can be equipped with a gas floating bed for cooling. 

7)Processing of warping boards:
In an orderly factory, the printed board will perform a 100% flatness check when the final inspection is conducted.All unqualified boards will be picked out and placed in the oven for 3 to 6 hours at 150 degrees Celsius and under heavy pressure, and naturally cool under pressure.Then unload the pressure and take out the board, which can be used to check the flatness, so that some boards can be saved, and some boards need two to three times of baking pressure to be levelled.Shanghai hubao agent's air pressure plate warping machine has a very good effect in repairing circuit board warping with the use of Shanghai bell.If the anti-warping measures mentioned above are not implemented, some boards are useless and can only be scrapped.

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