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20L ENIG High TG FR4 Circuit Board

20L ENIG High TG FR4 Circuit Board

20L ENIG high FR4 circuit board 1.video description UNIWELL circuits cO., lTD. is a high-tech company and it was found in 2007, we focus on design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit Board) focusing on quick turn, prototype,...

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1.Product describe

图片192_副本.jpg 

Specification
Layer:20  
Board Thickness:2.6 mm
Surface treatment:immersion gold.
Material: FR4 tg170 .
Min line width/line distance:5.9/4.5mil
Min hole:0.3mm

2.Video description
Uniwell circuits co., lTD. is a high-tech company  and it was found in 2007, we focus on design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit Board) focusing on quick turn, prototype, medium and large volumes for 10+ years, we have rich experience in PCB production and PCB assembly. At present we mainly produce the high-performance PCB board from 2L-14L and above, they are applied mainly in consumer electronics, power supply, mechanical apparatus, automobile and others. There is a video about Uniwell. We are expecting be your long term partner in China.

3.Customers distribute
Our customers are widely distributed in China, Japan, Korea, Europe and America. For the demand of world environment, we have successfully produced the environmental products of OSP (mainly used in Lead Free weld),immersion gold, Lead free HASL,helogen free with the efforts of all workers in Digital, we also develop the thin board ,heavy copper PCB,HDI and Aluminum board to meet the challenge in the future. We lead environmental, light, multi- &sophisticated high-performance PCB for purpose in future. 

图片193_副本.jpg

4.Technical capabilities
We have a powerful R&D team to constantly improve our technology, our capability are more and more stronger.

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP

5.What are the categories of FPC?
High quality FPC to achieve interconnection.This component will block the signal line in the flat ribbon cable soft FPC, which is a necessary part of the rigid FPC.At higher levels of operating situation, after completion of manufacture, FPC, forming a vertical s-shaped curve, which provides the z plane of interconnection approach, and in the x, y, and z plane vibration under the action of stress, can eliminate the stress and strain on the tin solder joints.Here is a guide to the classification of the multi-layer FPC software: 

1) multilayer FPC flexible insulating substrate composition, the provisions of the finished product is can flexure: this structure is usually a lot of one-sided or two-sided microstrip flexible FPC bonding together two sides of the end, but the central part and at the end of the bonded together, which is highly flexible.In order to have the desired electrical characteristics, such as the characteristic impedance performance and the rigid phase that it interconnects, each line layer of the multilayer soft FPC component must design the signal line on the ground surface. 

2) it is composed of multi-layer FPC on soft insulating substrate, which can be flexibly bent in the end of the finished product: this kind of multi-layer softness is made of soft insulating materials such as polyimide film, and the layer is pressed into multilayer plates.It loses its inherent flexibility after laminating.This type of soft FPC is used when the design requirements are to maximize the insulation characteristics of the film, such as low dielectric constant, thickness uniformity medium, light weight and continuous processing.For example, a multilayer FPC made of polyimide film insulation is about a third lighter than a rigid FPC of epoxy glass. 

3) a multilayer FPC is formed on the soft insulating substrate, and the finished product must be able to be formed, rather than a continuous flexure: this kind of multi-layer soft FPC is made of soft insulating material.Though it is made of soft material, but because of limited by electrical design, such as for the conductor resistance, request with thick conductors, or to the required impedance or capacitance, requires the signal between the ground plane and a thick layer of insulation isolation, therefore, it has when it is applied in product shape. 

To be highly flexible, the FPC can be coated with a thin layer of suitable coatings, such as polyimide, in place of a thicker layer.The metallized hole enables the interconnection of the z plane between the flexible circuit layers.The FPC with good quality service is best suited for the design of flexible, high reliability and high density.

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