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18L ENIG High TG FR4 Circuit Board

18L ENIG High TG FR4 Circuit Board

18L ENIG high tg FR4 circuit board 1.Company profile Uniwell circuits has passed the ISO9001 management system certification, and the products have been certified by UL, SGS and RoHS. Uniwell circuits has a professional technical development team, which possesses the advanced technology of the...

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1.Production describe

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Specification:
Layer:18
Board Thickness: 1.60 mm
Surface treatment: immersion gold.
Material: FR4 TG170.
Min line width/line distance:8/8mil

Application: communication, network, digital products, industrial control, medical care, aeronautics & astronautics, defense & military fields, etc.
If you're not sure whether your particular operation requires FR-5 high-TG boards or how exactly a TG PCB works to protect your sensitive circuits during implementation, we're happy to tell you everything you need to know. Read on to gain a full understanding of just how a high-temperature PCB works and what it can do for you. Once you're satisfied that FR-4 high-TG boards are right for you, Uniwell is happy to help you to solve this problem, please feel free to contact us.

2.Company profile
Uniwell circuits has passed the ISO9001 management system certification, and the products have been certified by UL, SGS and RoHS. Uniwell circuits has a professional technical development team, which possesses the advanced technology of the industry, and has a reliable production equipment, testing equipment and a fully functional physical and chemical laboratory. PCB products include 2-40 laminate, HDI board, high TG thick copper plate, soft and hard bonded board, high frequency board, composite dielectric laminate, blind buried plate, metal substrate and non-halogen board . PCB circuit board products are widely used in high-tech fields such as communication equipment, computer, industrial control, power electronics, medical instrument, security electronics, consumer electronics, automobile electronics, etc. PCB board products are exported to North America, South America, Europe, southeast Asia and other countries and regions, we are hoping to be your long term partner in China.

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3.Equipped with advanced test equipment
All Uniwell products are 100% tested, which guarantees product’s quality effectively. There are a great deal of advanced test equipment, including  AOI, flying probe tester and more. We offer one-stop service and meet the customers’ needs in the shortest time. As the name implies, fast line can provide quick service so that the lead time can be within 24 hours.

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4.Lead time
To expedite quick samples within 24 hours is available and extra charges will be on your account for the service.

Layers

Quick-turn

Sample order

Mass order

single

24 hours

3working days

7working days

double

24 hours

4working days

7working days

4-6layer

48hours

5-6working days

10working days

8-12layer

120hours

7-9working days

15working days

FR-4 based, Exclude material lead time

5.Packing & delivery
Packaging details: Vacuum packing or Anti-static package, Outer: Standard export carton.

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Delivery
For sample, we will ship the boards to you by DHL,UPS,FedEx,EMS. We have long term cooperation with them, they will offer the best price
For mass production, we may ship your PC boards by ship or by air , it maybe will take longer time, but it will save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.

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6.Little knowledge--- ENIG
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold, which protects the nickel from oxidation. 

ENIG has several advantages over more conventional (and cheaper) surface platings such as HASL (solder), including excellent surface planarity (particularly helpful for PCBs with large BGA packages), good oxidation resistance, and usability for untreated contact surfaces such as membrane switches and contact points. 

Early ENIG processes suffered from reliability issues which caused the ENIG finish to separate from the copper pads, taking the parts with them. ENIG also does not wet as evenly or easily as HASL. In addition, a "black-pad" of nickel (Ni) phosphorus  could form during the electroless nickel plating step, more specifically due to the solder mask sulfur substances leaching into the plating bath, greatly reducing solder joint reliability. To remedy this, a layer of electroless palladium can be plated onto the nickel to create ENEPIG surface finish. 

ENEPIG is a costlier finish, but offers the best characteristics for printed circuit boards. The process requires more steps, compared to other common finishing types. 

The electroless nickel step is an auto-catalytic process that involves depositing nickel on the palladium-catalyzed copper surface. The reducing agent containing nickel ions must be replenished in order to provide proper concentration, temperature and pH levels necessary to create a consistent coating. During the immersion gold step, the gold adheres to the nickel-plated areas through molecular exchange, which will protect the nickel until the soldering process. The gold thickness needs to meet certain tolerances to ensure that the nickel maintains its solderability. 

IPC Standard IPC-4552 covers the quality and other aspects of ENIG finish on printed circuit boards. IPC-7095 covers some "black pad" related features such as so called mud crack appearance and nickel protrusion spike.

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