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14L Immersion Gold High TG FR4 Circuit Board

14L Immersion Gold High TG FR4 Circuit Board

14L ENIG high tg FR4 PCB 1.company information Uniwell Circuits Co., Ltd, was established in Shenzhen, China in April, 2007. Uniwell Circuits is a high-tech company special for design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit Board)...

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1.Product describe


Layer: 14
Board Thickness: 1.6 mm
Surface treatment: immersion gold.
Material: FR4 TG170.
Min line width/line distance:5/12mil.
Special requirement: impedance control

Uniwell Circuits specialized is engaged in the production of high technical content, strict quality of high precision PCB (2 ~ 40 layers), all kinds of double side, multi-layer, multilayer blind buried via PCB, single multilayer soft circuit board (FPC), aluminum board and other special circuit board PCB manufacturers.

2.Company information
Uniwell Circuits Co., Ltd, was established in Shenzhen, China in April, 2007. Uniwell Circuits is a high-tech company special for design, development, manufacture and sales of high precision double-sided & multilayer PCBs (Printed Circuit Board) focusing on quick turn, prototype, medium and large volumes. Uniwell Circuits has also met the highest international manufacturing standards by being approved for these quality certificates: ISO9001, ISO14001, TS16949. We are UL certified for single sided, double sided and multilayer PCB production, and adhere to all of the requirements for IPC and ROHS standards.

In order to adapt to the update of electronic products, the printing plate processing technology requires a high number of varieties, the company has expanded rapidly, and has equipped with the advanced processing equipment. We have trained a professional team engaged in printing plate processing.Improve the market development, engineering design, processing and manufacturing, quality assurance, after-sales service network management system.We have obtained UL certification, passed ISO9001 quality system certification and ISO14001 environmental system certification. 

Our products are widely used in computer, communication, automobile, medical equipment, photoelectric instrument and other fields, customers in North America, Europe, Asia and other parts of the world. 


3.Company Strategies
Win-win partnership
● Follow and support customers strategy to acquire market
Value-added Service
● Inset value-added service base on customer requirement
Cost optimization
● Continuous effect and efficient management to push manufacturing cost down
On-Time delivery
● Improve delivery control procedure to ensure delivery on-time
Quality commitment
● Quality assurance and self-review system to ensure quality promotion
Ship to stock
● Effective logistic control and quality product to ensure just-in-time stock

4.Quality policy:
Transcendent quality, Perfect embodiment, Prevent pollution, Energy efficiency, Green production, Continual improvement, Customers' satisfaction 


5.What is the process of PCB multilayer lamination in shenzhen PCB?
Is a full of high temperature saturated water vapor, and can exert high pressure container, after can be laminated substrate (Laminates) of the sample, at one time, forced to make water vapor into the plate, and then remove the plate sample at high temperature of molten tin surface, measuring its characteristics of "stratified resistance".This word is a synonym for Pressure Cooker, which is often used by the industry.In addition, there is a "tank pressure method" of carbon dioxide at high temperature and high pressure in the process of multi-layer lamination, and also such Autoclave Press. 

2)Cap lamination 
Refers to the traditional early multilayer PCB laminate method, then the "outer" MLB BoJi board of the single copper composite and more pressing, until the end of 1984, after a huge MLB output to switch to the current copper type large or legal (Mss) Lam, a lot of pressure.In this early stage, MLB pressure is legal, called Cap Lamination. 

In multi - laminar compression, it is often referred to as the copper skin in the treatment of the wrinkling that did not occur at that time.The thin copper skin below 0.5 oz is more prone to such defects in multi-layer compression.

It is indicated that the surface of the copper surface has a smooth and uniform depression, which may be caused by the partial puncture of the steel plate used in the compression, and if the fault line is presented with a neat descending order, it is called Dish Down.Such shortcomings, if unfortunately, remain on the circuit when the copper is corroded, the impedance of the high-speed transmission signal will be unstable, and Noise Noise will occur.Therefore, it should be avoided on the copper surface of the base plate.

5)Caul Plate
Sandwich Plate under pressure, right in the press between each of the (Opening), many DieLa "copies" to press the board of the bulk material (such as 8 ~ 10 sets), the cost between "loose material" (Book), shall be of stainless steel Plate of flat, smooth and hard to be separated, the Caul of dividing use mirror stainless steel Plate according to Plate or Separate Plate, the common people such as AISI 430 and AISI 630.

6)Foil Lamination
Refers to the production type sandwich plate, its outer mining layer of copper foil and film directly with leather pressing, now ranks of a multilayer board large clamp method (Mass Lam), to replace the traditional pressure of single BoJi board early legal.

7)Mass Lamination
This is a multi - laminate process to give up the "alignment tip" and adopt the new construction method with multiple platen on the same surface.Since 1986, there has been a great change in the method of pressing the multi-laminates when the demand for the four or six layers has increased.Early one to press process only on board a ship plate, at the mercy of such a one to one in the new law has to break through, according to the size to a pair of two, or a pair of four, and even more pressing plate top.The second law is to eliminate all kinds of materials (such as inner laminates, film, outer veneer, etc.);Instead, the outer layer is converted to copper foil, and the "target" is prefabricated on the inner plate. After the pressure is pressed, the target will be "cleaned", and then the tool hole can be drilled into the drilling machine.As for the six or eight laminates, the film of each inner layer and the sandwich can be riveted with rivets before the high temperature compression.This simplified and rapid increase in the pressure of area can also increase the number of "fold "(High) and Opening (Opening) according to the basic plate type, which can both reduce labor and double production, and can even be automated.This new concept is called "a lot of depressions" or "large depressions".In recent years, there have been many professional industries in China.

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