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10 Layers Gold Immersion High Frequency Circuit Board

10 Layers Gold Immersion High Frequency Circuit Board

10 layers gold immersion high frequency circuit board 1.product describe Specification Layer: 10 layer material: Ro4350B+FR4 Thickness: 1.5 mm Surface finished: ENIG (2U”) Minimum aperture: 0.35mm. Application: network Features: high frequency mixing. We recommend you speak with the experts here...

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10 layers gold immersion high frequency circuit board

1.Product describe


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Specification
Layer: 10 layer
material: Ro4350B+FR4
Thickness: 1.5 mm
Surface finished: ENIG (2U”)
Minimum aperture: 0.35mm.
Application:  network
Features: high frequency mixing.


We recommend you speak with the experts here at Uniwell to learn more about these high-frequency laminates and get a better understanding on the selection process.


Our goal is to find the best fit for your needs and your budget, based on your PCB. Sometimes, that means choosing a laminate that you might have initially written off. For example, you might see a laminate with a higher dielectric constant as a costlier option, until you determine if it actually yields more circuits per panel in most cases.


You’ll also avoid potential hazards by working with a leading RF printed circuit boards supplier. We can make sure your laminate has the proper thermal conductivity for those high-power microwave amplifier applications, but also ensure you have a low dissipation factor in order to reduce circuit insertion losses.2. our certification


2.Why us?
Quality
Our UL/Rohs standards insure quality assemblies from start to finish. Whether it's a simple custom product or a complex turnkey production run, Uniwell will adhere to the highest quality standards.
   
Capable
Uniwell offers the latest in assembly capabilities and qualifications insuring that quality is built into every product we produce.
   
Experience
When it comes to your build you want a partner you can depend on. Our management team has over 10years of combined industry knowledge. Our engineering team has over 8 years experience.
   
Protecting your interests
Protecting your Intellectual Property is job one! Our staff colleague of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.
   
Flexibility
Uniwell pride ourselves on our ability to custom tailor programs around our customers' needs. We take time to listen to your unique business needs and then set out to surpass them.

3.Technology sheet

Material

FR4,CEM-3,Metal Core,

Halogen Free, Rogers, PTFE

Max. Finishing Board Size

1500X610 mm

Min. Board Thickness

0.20 mm

Max. Board Thickness

8.0 mm

Buried / Blind Via (Non-cross)

0.1mm

Aspect ration

16:01

Min. Drilling Size(Mechanical)

0.20 mm

Tolerance PTH/ Pressing fit hole /NPTH

+/-0.0762 mm / +/-0.05mm / +/-0.05mm

Max. Layer Count

40

Max. copper (inner/outer)

6OZ/10 OZ

Drill tolerance

+/-2mil

Layer to layer registration

+/-3mil

Min. line width/space

2.5/2.5mil

BGA pitch

8mil

Surface treatment

HASL, Lead free HASL,

ENIG, Immersion silver/Tin, OSP


4.Little knowledge--- How to Select the Right PCB Material for High Frequency Applications?
While choosing the right Printed Circuit Board (PCB) material for a high frequency application, you are required usually to tradeoff between performance and price. Two main questions that are crucial while selecting a PCB material are:Does the material meet the needs of an end-user application?
What kind of efforts are required to fabricate a circuit with a particular material?
This post will help you choose the right PCB material for high frequency applications: What Materials are typically used in High Frequency PCB Assembly? The following table shows the materials used for high frequency PCB assembly, their ease of circuit fabrication, and electrical performance:

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Choosing materials based on circuit fabrication issues:
Various mechanical processes such as plated-through-hole (PTH) preparation, drilling, multilayer lamination, and assembly, are performed during high-frequency PCB fabrication. The drilling process is used for creating clean holes, which are metalized to form electrical connections.
There are several challenges involved in fabricating multilayer PCBs. One of the major challenges is that dissimilar materials are being joined together. The properties of these dissimilar materials complicate the PTH preparation and drilling processes. Furthermore, a disparity between material properties, such as coefficient of thermal expansion (CTE), can lead to consistency problems when the circuit is stressed thermally during assembly. 


The following table shows the CTE values of materials that are used in high frequency PCBs:

图片76.jpg

 
The main objective of the material selection process for a multilayer PCB, is finding a right combination of circuit materials. The combination should allow practical fabrication processing and meet end-user requirements. The above information will help you in choosing the right PCB material for high frequency applications. If you still have doubts, you can get in touch with professionals having expertise in designing PCBs for high frequency applications.The main objective of the material selection process for a multilayer PCB, is finding a right combination of circuit materials. The combination should allow practical fabrication processing and meet end-user requirements.

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